卢启军
个人信息:Personal Information
副教授
性别:男
出生日期:1986-08-10
毕业院校:西安电子科技大学
学历:博士研究生毕业
学位:工学博士学位
在职信息:在岗
所在单位:微电子学院
入职时间:2015-11-23
学科:微电子学与固体电子学
办公地点:北校区东大楼416室
电子邮箱:
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- [1]Qijun Lu, Jianqin Deng*, Guangbao Shan, and Zhangming Zhu.Wideband Compact Power Amplifier Based on Novel Spatial Power Combining Technique for Millimeter-Wave Applications.Microwave and Optical Technology Letters.2021,63 (1):160-165
- [2]Milimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate.IEEE Access.2020,8 :67921-67928
- [3]Qijun Lu, Zhangming Zhu*, Guangbao Shan, Yang Liu, Xiaoxian Liu, Xiangkun Yin.3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications.IEEE Transactions on Components, Packaging and Manufacturing Technology.2019,9 (9):1855-1862
- [4]Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem.IEEE Transactions on Components, Packaging and Manufacturing Technology.2019,9 (7):1310-1318
- [5]Qijun Lu, Zhangming Zhu*, Yang Liu, Xiaoxian Liu, Xiangkun Yin.Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias.IEEE Transactions on Electromagnetic Compatibility.2018,60 (6):1915−1922
- [6]A 110-170 GHz Spatial Power-Combined Frequency Tripler with 5.7%-7.8% Efficiency and 0.5 W Power Handling.Microwave and Optical Technology Letters.2018,60 (5):1079-1085
- [7]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li.Closed-Form Internal Impedance Model and Characterization of Mixed Carbon Nanotube Bundles for Three-Dimensional Integrated Circuits.Chinese Physics B.2018,27 (1):017303
- [8]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li.High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects.IEEE Transactions on Components, Packaging and Manufacturing Technology.2017,7 (12):2036−2044
- [9]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li.Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias.IEEE Transactions on Nanotechnology.2017,16 (4):695−702
- [10]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding.Analysis of Propagation Delay and Repeater Insertion in Single-Walled Carbon Nanotube Bundle Interconnects.Microelectronics Journal.2016,54 :85-92
- [11]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding.Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias.IEEE Transactions on Electron Devices.2015,62 (5):1544-1552
- [12]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding.Influence of Temperature on the Conductivity of Multi-walled Carbon Nanotube Interconnects.Chinese Physics Letters.2015,32 (4):047305
- [13]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding.Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs.IEEE Microwave and Wireless Components Letters.2014,24 (5):294−296
- [14]Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding.Type of Distortionless Through Silicon Via Design Based on the Multiwalled Carbon Nanotube.IET Micro & Nano Letters.2013,8 (12):869−871
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