|
个人信息：Personal Information
研究员
性别：男
出生日期：1977-04-09
毕业院校：西安微电子技术研究所
学历：博士研究生毕业
学位：工学博士学位
在职信息：在岗
所在单位：微电子学院
入职时间：2018-03-26
学科：集成电路系统设计 微电子学与固体电子学
扫描关注
-
1．集成芯粒（chiplet）设计
2．集成芯粒/微系统智能化设计3. 可重构射频微系统/电路设计
- High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress-Strength Interference Modeling.IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY.2024,14(4)
- Intelligent Multifield Collaborative Optimization Method For Tsv Array With Performance Constraints.IEEE Transactions On Electron Devices.2023
- 单光宝.Application And Prospect Of Artificial Intelligence Methods In Signal Integrity Prediction And Optimization Of Microsystems.Micromachines.2023,14(2)
- Design Of Spectrum Processing Chiplet Based On Fft Algorithm.Micromachines.2023,14(2)
- 单光宝.Thermodynamic Multi-field Coupling Optimization Of Microsystem Based On Artificial Intelligence.Micromachines.2023,14(2)
- A Brief Review Of Fem Simulation Techniques For Ic Packaging Under Impact Load.2020 21st International Conference On Electronic Packaging Technology (icept).2020
- 暂无内容
- 暂无内容