电子科技 ›› 2022, Vol. 35 ›› Issue (2): 1-6.doi: 10.16180/j.cnki.issn1007-7820.2022.02.001

• •    下一篇

高集成小型化中频滤波组件设计与实现

白锐,徐达,杨亮,孙从科,王绍东   

  1. 中国电子科技集团公司第十三研究所,河北 石家庄050051
  • 收稿日期:2020-10-23 出版日期:2022-02-15 发布日期:2022-02-24
  • 作者简介:白锐(1980-),男,高级工程师。研究方向:微波毫米波集成电路设计。|徐达(1982-),男,博士,高级工程师。研究方向:微组装工艺及可靠性分析。
  • 基金资助:
    国家自然科学基金(61831016)

Design and Implementation of High Integration and Miniaturization IF Filter Module

BAI Rui,XU Da,YANG Liang,SUN Congke,WANG Shaodong   

  1. The 13th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang 050051,China
  • Received:2020-10-23 Online:2022-02-15 Published:2022-02-24
  • Supported by:
    National Natural Science Foundation of China(61831016)

摘要:

为满足雷达接收机中频滤波器组集成滤波器数量多、集成度高的需求,文中采用三维集成技术,设计了一种小型化LC滤波器电路,并对三维LC滤波器在组件中的应用和集成工艺进行分析和研究。三维LC滤波器采用两个基板,利用三维集成工艺和BGA技术实现两个基板的三维集成组装。将电容元件置于底层基板可实现高密度布局,将电感元件置于顶层基板与电容元件分离,通过焊球实现信号互通。结果表明,采用三维集成方案可使LC滤波器电路尺寸减小近50 %,滤波器指标与平面滤波器电路性能一致。相比于传统中频滤波组件设计方法,该方案更有利于实现高集成度和小型化。

关键词: 中频滤波组件, 开关滤波器, LC滤波器, 三维集成, 球栅阵列, 多功能, 小型化, 高集成

Abstract:

To meet the demand of large number and high integration of filters in the IF filter modules of radar receivers, a miniaturization LC filter based on the 3D integration technology is proposed in this study. The application and integrating process of 3D LC filter in modules are studied and analyzed. The 3D LC filter adopts two substrates, and uses 3D integration process and BGA technology to realize the three-dimensional integrated assembly of the two substrates. High-density layout can be realized by placing capacitive elements on the bottom substrate. Inductive elements are placed on the top substrate and separated from the capacitive elements, and signal communication is achieved through solder balls. The use of a three-dimensional integration scheme can reduce the size of the LC filter circuit by nearly 50%, and the filter index is consistent with the performance of the planar filter circuit. Compared with the traditional IF filter component design method, this solution is more conducive to achieve high integration and miniaturization.

Key words: IF filter module, switch filter bank, LC filter, 3D integration, BGA, multi-function, miniaturization, high integration

中图分类号: 

  • TN713
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