二值化和孔洞填充融合差分的微精密玻璃封装电连接器同心度检测

doi:10.16180/j.cnki.issn1007-7820.2021.07.011

电子科技 ›› 2021, Vol. 34 ›› Issue (7): 61-66.doi: 10.16180/j.cnki.issn1007-7820.2021.07.011

二值化和孔洞填充融合差分的微精密玻璃封装电连接器同心度检测

王高伟,王福忠,刘群坡,王满利,高如新,王振营

河南理工大学电气工程与自动化学院,河南焦作 454000

收稿日期:2020-04-06 出版日期:2021-07-15 发布日期:2021-07-05
作者简介:王高伟(1990-),男,硕士研究生。研究方向:图像处理、人工智能。|王福忠(1961-),男,博士,教授。研究方向:工业过程控制、智能电网和故障诊断。|刘群坡(1978-),男,博士,副教授。研究方向:特殊环境机器人及智能装备。
基金资助:
国家重点研发计划专项(2016YFC0600906);河南省高校科技创新团队(20IRTSTHN019);河南省创新型科技人才队伍建设工程(CXTD2016054);河南理工大学创新型科技团队(T2019-2);河南理工大学博士基金(722103/001/070);河南省科技攻关项目(172102210270)

Concentric Detection of Micro-Precision Glass Encapsulated Electrical Connectors by Binary and Hole Filling Fusion Differential

WANG Gaowei,WANG Fuzhong,LIU Qunpo,WANG Manli,GAO Ruxin,WANG Zhenying

School of Electrical Engineering and Automation, Henan Polytechnic University,Jiaozuo 454000,China

Received:2020-04-06 Online:2021-07-15 Published:2021-07-05
Supported by:
Special Projects Supported by the National Key Research and Development Plan(2016YFC0600906);Science and Technology Innovation Team of Henan University(20IRTSTHN019);Henan Province Innovative Science and Technology Talent Team Construction Project(CXTD2016054);Innovative Science and Technology Team of Henan University of Science and Technology(T2019-2);Doctor's Fund of Henan University of Science and Technology(722103/001/070);Henan Science and Technology Project(172102210270)

摘要/Abstract

摘要：

目前电子行业大量使用的微型精密玻璃封装电连接器同心度检测采用人工为主的检测方法,效率及准确度较低。文中针对圆柱体玻璃封装电连接器表面纹理较为复杂及高温玻璃柱与低温玻璃柱边界轮廓难以确定的问题,提出了基于二值化和孔洞填充融合差分的算法,得到了清晰的内圆图像。利用连通域面积最大法对空洞填充后的图像进行处理,去除背景纹理带来的噪声,得到电连接器主体外圆图像。最后建立基于内圆和外圆坐标信息的同心度计算模型,得到同心度等参数。实验结果表明,同心度检测时间由大于6.5 s缩短为小于0.32 s,准确率达90%以上。

关键词: 玻璃封装, 电连接器, 同心度检测, 孔洞填充, 差分运算, 内圆图像, 面积最大法, 主体外圆

Abstract:

The micro-precision glass encapsulated electrical connector is widely used in the electronic industry. At present, manual detection is mainly used to detect concentricity, but the detection efficiency and accuracy can no longer meet the application needs. To solve the complex surface texture of cylindrical glass-encapsulated electrical connector and the difficulty in determining the boundary contour of high-temperature and low-temperature glass columns, a fusion difference algorithm based on binary and hole-filling is proposed, and clear inner circle image is successfully obtained. The image of the filled hole is processed by the maximum connected area method, the noise caused by the background texture is removed, and the outer circle image of the main body of the electrical connector is obtained. Then, a concentric calculation model is established based on the information of the inner and outer circle coordinates, and the concentricity parameters are obtained. The experimental results show that the time for concentric detection is shortened from more than 6.5 s for manual detection to less than 0.32 s, and the accuracy rate reaches more than 90%.

Key words: glass encapsulated, electrical connector, concentric detection, hole filling, difference operation, inner circle image, maximum area method, the main external circular

中图分类号:

TP391

王高伟,王福忠,刘群坡,王满利,高如新,王振营. 二值化和孔洞填充融合差分的微精密玻璃封装电连接器同心度检测[J]. 电子科技, 2021, 34(7): 61-66.

WANG Gaowei,WANG Fuzhong,LIU Qunpo,WANG Manli,GAO Ruxin,WANG Zhenying. Concentric Detection of Micro-Precision Glass Encapsulated Electrical Connectors by Binary and Hole Filling Fusion Differential[J]. Electronic Science and Technology, 2021, 34(7): 61-66.

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标号	外圆圆心/像素	内圆圆心/像素	同心度 /mm	纯人工检测结果
1	(328.19,256.03)	(319.51,253.30)	0.010 6	PASS
2	(319.512,53.30)	(319.47,248.30)	0.038 0	PASS
3	(318.55,248.84)	(326.59,254.20)	0.073 5	PASS
4	(318.85,254.31)	(329.39,245.20)	0.105 9	FAIL
5	(305.29,235.67)	(314.18,231.05)	0.076 2	PASS
6	(316.71,253.48)	(328.12,250.30)	0.090 1	FAIL
7	(323.13,244.65)	(332.64,241.20)	0.076 9	FAIL
8	(319.78,250.15)	(321.68,247.50)	0.024 8	PASS
9	(325.81,244.88)	(329.69,245.09)	0.029 6	PASS
10	(314.57,256.26)	(316.11,252.02)	0.034 3	PASS

二值化和孔洞填充融合差分的微精密玻璃封装电连接器同心度检测

Concentric Detection of Micro-Precision Glass Encapsulated Electrical Connectors by Binary and Hole Filling Fusion Differential

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