用于晶体振荡器温度补偿的次方电压产生方法

doi:10.16180/j.cnki.issn1007-7820.2019.12.005

摘要/Abstract

摘要：

为了获得更高精度的时钟源,需要对晶体振荡器进行温度补偿以便减小频率随温度的变化。对比晶体振荡器不同的温度补偿方式,模拟温度补偿具有较高的性能,而模拟温度补偿电路的主要模块就是获取与温度成次方关系的补偿电压。文中采用了一种模拟乘法器的方法来获得与温度成不同指数关系的电压,在全差分放大器的输入端接入4个MOS管,利用其工作于线性区时的电流电压关系并结合全差分放大器来实现两个模拟量之间的相乘,进而获得与温度成1次方、2次方、3次方、4次方和5次方关系的补偿电压。获得的这些电压通过加和电路叠加后即可用于晶体振荡器的高阶温度补偿。通过仿真,得到全差分放大器的差模增益为78.6 dB,乘法器可以实现两个信号的相乘,且应用该方法进行补偿的晶体振荡器的频率偏移为±2 ppm。

关键词: 晶体振荡器, 模拟温度补偿, 四管乘法器, 全差分放大电路, 共模反馈, 次方电压产生

Abstract:

In order to obtain a more accurate clock source, the crystal oscillator was compensated to reduce the frequency variation with temperature. Compared with different temperature compensation methods of crystal oscillators, analog temperature compensation had higher performance. The focus of the analog temperature compensation circuit was to obtain the compensation voltage exponentially. This paper presented an analog multiplier method. Four MOSFETs were connected to the inputs of the fully differential amplifier. Combining the current-voltage relationship in the linear region multiplied the two analog signals. Different compensation voltages which were linear, quadratic, cubic, quadratic, and fifth power relationship with temperature would be generated. These voltages were superimposed by the summing circuit and could be used for high-order temperature compensation of the crystal oscillator. The differential mode gain of the fully differential amplifier was 78.6 dB, and the two inputs were multiplied by multiplier. Temperature stability of ±2 ppm deviation was achieved.

Key words: crystal oscillator, analog temperature compensation, four-tube multiplier, fully differential amplifier circuit, common mode feedback, exponential voltage

中图分类号:

TN492

孙晓化,王宏兴,张启东. 用于晶体振荡器温度补偿的次方电压产生方法[J]. 电子科技, 2019, 32(12): 22-26.

SUN Xiaohua,WANG Hongxing,ZHANG Qidong. Exponential Voltage Generation Method for Crystal Oscillator Temperature Compensation[J]. Electronic Science and Technology, 2019, 32(12): 22-26.

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补偿种类	实现方式	优点	缺点
直接模拟补偿方式	利用热敏电阻组成温度补偿网络	结构简单、体积小、价格低	芯片体积较大,功耗较高,补偿的精度低
间接模拟补偿方式	集成式的芯片间接进行模拟温度补偿	对温度的检测准确,补偿的温度范围宽	电路复杂,面积大
数字补偿方式	由温度传感器,时序控制器,A/D转换器,存储器,VCXO 电路构成	在很宽的温度范围内频率稳定性高	补偿数据离散,会发生跳变
微传感器补偿方式	用微处理器替代了数字补偿中的存储器和时序控制器	在数字温度补偿的基础上,进一步提高了输出频率的稳定性	补偿数据离散,外围电路复杂,不利于小型化