加速退化试验改进的故障模式影响及危害性分析

doi:10.3969/j.issn.1001-2400.2017.03.028

西安电子科技大学学报

加速退化试验改进的故障模式影响及危害性分析

陈然;连光耀;孙江生;李会杰

(军械工程学院军械技术研究所, 河北石家庄 050003)

收稿日期:2016-04-08 出版日期:2017-06-20 发布日期:2017-07-17
作者简介:陈然(1991-)，男，军械工程学院硕士研究生，E-mail: Interran@126.com
基金资助:
国家部委预研资助项目(51327030104)

Failure mode effect and critical analysis optimized by the accelerated degradation test

CHEN Ran;LIAN Guangyao;SUN Jiangsheng;LI Huijie

(Ordnance Engineering College, Ordnance Technology Institute, Shijiazhuang 050003, China)

Received:2016-04-08 Online:2017-06-20 Published:2017-07-17

摘要/Abstract

摘要：

针对传统方法依赖人工经验，导致故障样本的主观性、盲目性等问题，提出了加速退化试验改进的故障模式影响及危害性分析方法．首先，通过有限元仿真分析识别了受试对象存在的薄弱环节和及退化失效特征; 然后，根据加速退化试验，得到了受试对象在相应退化应力下典型的故障模式和发生概率;最后，实现了故障模式影响及危害性的最终分析．实例验证表明，该方法可对传统方法提供有效的补充和修正，进而为测试性验证试验提供更为多样、可靠的备选样本．

关键词: 故障模式影响及危害性分析, 有限元分析, 加速退化试验, 外场可更换模块

Abstract:

An improved failure mode effect and critical analysis(FMECA) method optimized by the accelerated degradation test is presented in order to solve the subjectivity and blindness problems caused by the existing FMECA method that relies on manual experience. First, weak links and the properties and degradation failure characteristics of the module could be acquired by finite element simulation analysis. Then the typical failure modes and the occurrence probability could be obtained according to the accelerated degradation test. Finally, the FMECA could be accomplished. Case study shows that the optimized method could provide effective complement and correction for the traditional FMECA,which could provide more diverse and reliable alternative fault samples.

Key words: failure mode effect and critically analysis, line replaceable module, accelerated degradation test, finite element analysis

陈然;连光耀;孙江生;李会杰. 加速退化试验改进的故障模式影响及危害性分析[J]. 西安电子科技大学学报, 2017, 44(3): 164-169.

CHEN Ran;LIAN Guangyao;SUN Jiangsheng;LI Huijie. Failure mode effect and critical analysis optimized by the accelerated degradation test[J]. Journal of Xidian University, 2017, 44(3): 164-169.

参考文献

［1］ UNITED STATES DEPARTMENT OF DEFENSE. Maintenance Management Outline for System and Devices: MIL-STD-470A ［S］. United States Government Printing Office, 1983: 2-12.
［2］ COLLI A. Failure Mode and Effect Analysis for Photovoltaic Systems［J］. Renewable and Sustainable Energy Reviews, 2015, 50: 804-809.
［3］石君友. 测试性设计分析与验证［M］. 北京. 国防工业出版社, 2011: 282-284.
［4］闫迎军. 综合模块化航空电子设备结构设计［D］. 西安: 西安电子科技大学, 2006.
［5］ RAMAKRISHNAN A, PECHT M G. A Life Consumption Monitoring Methodology for Electronic Systems［J］. IEEE Transactions on Components and Packaging Technologies, 2003, 26(3): 625-634.
［6］ ROUET V, MINAULT F, DIANCOURT G, et al. Concept of Smart Integrated Life Consumption Monitoring System for Electronics［J］. Microelectronics Reliability, 2007, 47(12): 1921-1927.
［7］范菊平, 游海龙, 贾新章. 基极注入HPM导致的双极型晶体管失效分析［J］. 西安电子科技大学学报, 2014, 41(1): 92-97.
FAN Juping, YOU Hailong, JIA Xinzhang. Mechanism Analysis and Physical Process of Bipolar Junction Transistor Failure Due to HPM Injection from the Base［J］. Journal of Xidian University, 2014, 41(1): 92-97.
［8］ TSAI T R, SUNG W Y, LIO Y L, et al. Optimal Two-variable Accelerated Degradation Test Plan for Gamma Degradation Processes［J］. IEEE Transactions on Reliability, 2016, 65(1): 459-468.
［9］ ZHANG J, BLOOMFIELD M O, LU J Q, et al. Modeling Thermal Stresses in 3-D IC Interwafer Interconnects［J］. IEEE Transactions on Semiconductor Manufacturing, 2006, 19(4): 437-448.
［10］ KANDA R, JAIN K. Thermal Management of Low Volume Complex Electronic Systems［C］//Proceedings of the International Conference on Research and Innovations in Mechanical Engineering. New Delhi: Springer, 2014: 519-533.
［11］ KONG F Z, YIN W Y, MAO J F, et al. Electro-thermo-mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse［J］. IEEE Transactions on Advanced Packaging, 2010, 33(3): 729-737.
［12］ DONTCHEV A L, ROCKAFELLAR R T. Metric Regularity in Infinite Dimensions［M］. Implicit Functions and Solution Mappings. New York: Springer, 2014: 277-362.
［13］ LAIDLER K J. The Development of the Arrhenius Equation［J］. Journal of Chemical Education, 1984, 61(6): 494.
［14］罗俊, 王健安, 郝跃, 等. 基于加速退化试验的模拟IC寿命评估研究［J］. 微电子学, 2014(4): 523-526.
LUO Jun, WANG Jian'an, HAO Yue, et al. Lifetime Assessment of Analog IC Based on Accelerated Degradation Test［J］. Microelectronics, 2014(4): 523-526.
［15］ WANG L Z, PAN R, LI X Y, et al. A Bayesian Reliability Evaluation Method with Integrated Accelerated Degradation Testing and Field Information［J］. Reliability Engineering and System Safety, 2013, 112: 38-47.
［16］方永锋, 陈建军, 曹鸿钧. 可修复的k/n表决系统的可靠性分析［J］. 西安电子科技大学学报, 2014, 41(5):180-184.
FANG Yongfeng, CHEN Jianjun, CAO Hongjun. Analysis of Dynamic Reliability of the Repairable k-out-of-n System under Several Times Random Shocks［J］. Journal of Xidian University, 2014, 41(5): 180-184.
［17］周杰, 刘三阳. 条件自回归极差模型的对数正态拟极大似然估计［J］. 西安电子科技大学学报, 2007, 34(5): 828-834.
ZHOU Jie, LIU Sanyang. Lognormal Quasi-maximum Likelihood Estimate of CARR［J］. Journal of Xidian University, 2007, 34(5): 828-834.

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加速退化试验改进的故障模式影响及危害性分析

Failure mode effect and critical analysis optimized by the accelerated degradation test

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