J4 ›› 2011, Vol. 38 ›› Issue (4): 38-41.doi: 10.3969/j.issn.1001-2400.2011.04.007

• Original Articles • Previous Articles     Next Articles

Study of the Ohmic contact property of SiC

WANG Ping1,2;YANG Yintang3;GUO Lixin2;SHANG Tao1;LIU Zengji1
  

  1. (1. State Key Lab. of Integrated Service Networks, Xidian Univ., Xi'an  710071, China;
    2. School of Science, Xidian Univ., Xi'an  710071, China;
    3. Ministry of Education Key Lab. of Wide Band-Gap Semiconductor Materials and Devices, Xidian Univ., Xi'an  710071, China)
  • Received:2010-10-09 Online:2011-08-20 Published:2011-09-28
  • Contact: WANG Ping E-mail:pingwang@xidian.edu.cn

Abstract:

Multi-layer metal Ohmic contacts to 4H-SiC are investigated on the N+ion implanted layer with 950℃ annealing in Ar for 25 minutes and the n type epitaxial layer with a carrier concentration of 1.0×1019cm-3 with 1000℃ annealing in N2 for 2 minutes. The specific contact resistances obtained by the transmission line method (TLM) are 1.359×10-5Ω·cm2 and 3.44×10-6Ω·cm2, respectively. SIMS measurements show that the formation of the Ni silicide and the TiC facilitates to make the contacts become more Ohmic after annealing.

Key words: silicon carbide, Ohmic contacts, secondary ion mass spectrometry

CLC Number: 

  • TN305

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